If you make this connection, there will be smoke and sparks. Consequently, it is hazardous to connect the scope probe’s ground return lead to a printed circuit board or electrical equipment terminal or wire that is referenced to and floats above ground potential. It typically has an equipment grounding conductor that connects to the building’s electrical grounding system. Improved form factors and simplified EMI compliance: TI’s isolation technologies help achieve best in-class size, thermals and EMI.Consider a typical bench-type oscilloscope that connects to the ac outlet.Improved system robustness and reliability: TI’s portfolio of high-voltage isolated products achieves low latency, excellent common-mode transient immunity and robust performance.Key benefits of TI technologies for isolation include: To learn more about isolation, see all of our isolation solutions. TI’s portfolio of isolation technologies, including a capacitive SiO 2 insulation barrier and integrated transformers, help exceed Verband der Automobilindustrie (VDA), Canadian Standards Association (CSA) and Underwriters Laboratory (UL) standards without compromising performance. Galvanic isolation electrically separates two domains, allowing power or signals to transfer across the barrier without compromising human safety, while also preventing ground potential differences and improving noise immunity. Isolation is about reliable protection in the presence of dangerous high voltages. Reduced system footprint: Save board space, simplify board layout and achieve low parasitics using advanced multichip module technologies.Increased efficiency: Use smaller passives while switching at higher frequencies – without sacrificing efficiency – with multilevel converter topologies and advanced power-stage gate drivers.Improved thermal performance: Remove heat from the package with advanced cooling technologies, including enhanced HotRod™ QFN packaging, power wafer chip-scale packaging and top-side cooling.Less heat: Achieve excellent device switching performance with our advanced silicon and gallium-nitride technologies.Key benefits of TI technologies for power density include:
Higher power levels in smaller form factors are now possible using TI’s advanced process, packaging and circuit-design technologies. Power designers must squeeze more circuitry into their applications to differentiate their products while also increasing efficiency and enhancing thermal performance. USB Type-C & USB Power Delivery ICs (58)īoard area and height are becoming limiting factors as power demands increase.USB power switches & charging port controllers (166).Linear & low-dropout (LDO) regulators (605).
SMEXOSCOPE ANALOG AC DC DRIVERS
LCD & OLED display power & drivers (80).
Buck modules (integrated inductor) (185).Buck converters (integrated switch) (989).